• The Good, Bad, and Brilliance of Ultra High Density Interconnect (UHDi)

  • 2024/11/12
  • 再生時間： 21 分
  • ポッドキャスト

The Good, Bad, and Brilliance of Ultra High Density Interconnect (UHDi)

無料で聴く

ポッドキャストの詳細を見る

  • サマリー

  • What is Ultra High Density Interconnect (UHDi) technology, and why is it critical for modern PCB designs? How does collaboration between designers and fabricators ensure the success of UHDi boards? In this episode of The Printed Circuit Podcast, host Steph Chavez from Siemens talks with Anaya Vardya, CEO of American Standard Circuits, about Ultra High Density Interconnect (UHDi) technology and its growing importance in industries like telecommunications, aerospace, and medical devices. Anaya explains how UHDi enables smaller, higher-performance PCBs through advanced techniques like microvias and optimized layouts. He also discusses the key challenges in manufacturing these complex boards, such as sequential builds and specialized equipment. Listeners will learn about the importance of early collaboration between designers and fabricators to avoid costly mistakes and delays. Anaya and Steph also touch on the future of PCB technology and the increasing need for advanced solutions like UHDi. What You’ll Learn in this Episode: What is UHDi technology? (3:15) Feedback from the SMTA International Electronics Manufacturing Conference (5:00) What are the design advantages of using UHDi? (6:35) What are the disadvantages of using UHDi? (9:35) What are some typical applications where UHDi would be implemented? (12:25) What are the manufacturing challenges of UHDi technology? (14:15) Where can designers or engineers learn more about UHDi technology? (19:20) Connect with Steph Chavez: LinkedIn Website Connect with Anaya Vardya: LinkedIn Website
    続きを読む 一部表示

あらすじ・解説

What is Ultra High Density Interconnect (UHDi) technology, and why is it critical for modern PCB designs? How does collaboration between designers and fabricators ensure the success of UHDi boards? In this episode of The Printed Circuit Podcast, host Steph Chavez from Siemens talks with Anaya Vardya, CEO of American Standard Circuits, about Ultra High Density Interconnect (UHDi) technology and its growing importance in industries like telecommunications, aerospace, and medical devices. Anaya explains how UHDi enables smaller, higher-performance PCBs through advanced techniques like microvias and optimized layouts. He also discusses the key challenges in manufacturing these complex boards, such as sequential builds and specialized equipment. Listeners will learn about the importance of early collaboration between designers and fabricators to avoid costly mistakes and delays. Anaya and Steph also touch on the future of PCB technology and the increasing need for advanced solutions like UHDi. What You’ll Learn in this Episode: What is UHDi technology? (3:15) Feedback from the SMTA International Electronics Manufacturing Conference (5:00) What are the design advantages of using UHDi? (6:35) What are the disadvantages of using UHDi? (9:35) What are some typical applications where UHDi would be implemented? (12:25) What are the manufacturing challenges of UHDi technology? (14:15) Where can designers or engineers learn more about UHDi technology? (19:20) Connect with Steph Chavez: LinkedIn Website Connect with Anaya Vardya: LinkedIn Website
続きを読む 一部表示

The Good, Bad, and Brilliance of Ultra High Density Interconnect (UHDi)に寄せられたリスナーの声

カスタマーレビュー：以下のタブを選択することで、他のサイトのレビューをご覧になれます。

Audible.co.jp

Amazon.co.jp
レビューはまだありません。