• Reliability Matters

  • 著者： Mike Konrad
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Reliability Matters

著者： Mike Konrad
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  • Reliability Matters is a podcast on the subject of reliability of circuit assemblies. Reliability "best practices" and success stories are discussed. This podcast features interviews with experts in the electronic assembly industry.

    All electronic production segments which effect product reliability are on the table. This includes contamination, coating, cleanliness assessment, inspection, building for harsh environments, reflow, printing, failure analysis, board fabrication, and much more.

    Your Host:
    Mike Konrad began his career in the electronic assembly equipment industry in 1985. Mike founded Aqueous Technologies in 1992 in response to the Montreal Protocol and the resulting international treaty banning most popular cleaning/defluxing solvents.

    Mike is an internationally known speaker on the subject of increasing reliability through contamination removal and cleanliness quantification techniques and procedures. Mike was awarded “Distinguish Speaker Status” with SMTA in 2018 and received the “Rich Freiberger Best of Conference Award” in 2019.

    Mike is a member of the SMTA Global Board of Directors where he is Vice President of Communications. Mike is also Vice President of Technical Programs for the Los Angeles / Orange County SMTA Chapter.

    Visit the Reliability Matters Podcast Website:
    https://www.reliabilitymatterspodcast.com
    Copyright Mike Konrad
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あらすじ・解説

Reliability Matters is a podcast on the subject of reliability of circuit assemblies. Reliability "best practices" and success stories are discussed. This podcast features interviews with experts in the electronic assembly industry.

All electronic production segments which effect product reliability are on the table. This includes contamination, coating, cleanliness assessment, inspection, building for harsh environments, reflow, printing, failure analysis, board fabrication, and much more.

Your Host:
Mike Konrad began his career in the electronic assembly equipment industry in 1985. Mike founded Aqueous Technologies in 1992 in response to the Montreal Protocol and the resulting international treaty banning most popular cleaning/defluxing solvents.

Mike is an internationally known speaker on the subject of increasing reliability through contamination removal and cleanliness quantification techniques and procedures. Mike was awarded “Distinguish Speaker Status” with SMTA in 2018 and received the “Rich Freiberger Best of Conference Award” in 2019.

Mike is a member of the SMTA Global Board of Directors where he is Vice President of Communications. Mike is also Vice President of Technical Programs for the Los Angeles / Orange County SMTA Chapter.

Visit the Reliability Matters Podcast Website:
https://www.reliabilitymatterspodcast.com
Copyright Mike Konrad
政治・政府
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  • Episode 156: An Introduction to Flexible Circuits with Joseph Fjelstad

    Episode 156: An Introduction to Flexible Circuits with Joseph Fjelstad
    2024/11/12
    On today’s episode, we’re turning our focus to a pivotal innovation that has transformed design and manufacturing processes: flexible circuits.

    Flexible circuits have emerged as a game-changer in the manufacturing and design of electronic assemblies. With their unique ability to bend, twist, and conform to complex shapes, they offer unparalleled advantages in applications where space is at a premium and reliability is paramount.
    From wearable technology and medical devices to aerospace systems and consumer electronics, the use of flexible circuits has expanded rapidly, bringing with it both opportunities and challenges.
    In this episode, we’ll explore the evolution of flexible circuit technology, discussing its key benefits, such as lightweight construction, enhanced durability, and improved design freedom.

    We’ll also touch on the manufacturing complexities, material considerations, and the critical role that process control plays in ensuring reliability and performance.

    My guest today is Joseph Fjelstad. Joe is the founder of Verdant Electronics. Joseph Fjelstad has been active in electronics manufacturing since 1972 in various roles, including as a chemist, process engineer, and R&D manager. He holds nearly 190 U.S. Patents and numerous foreign ones.
    He is an internationally recognized expert, inventor and lecturer in the field of electronics interconnection technology and a veteran of several startup companies, including: Beta Phase, ELF Technologies, MetaRAM, Silicon Pipe, and Tessera (now the public company, Xperi).

    Some of Joe’s innovative devices and novel reliability improving IC packaging structural features are found in nearly every electronic device made today.

    He is also an author, co-author or editor of several books on interconnection technology, including Flexible Circuit Technology 4th Edition, the most widely distributed reference book on the topic, Chip Scale Packaging for Modern Electronics, and Solderless Assembly For Electronics — The SAFE Approach.

    In addition, Fjelstad has written hundreds of articles, columns and commentaries for various industry magazines and journals over the last five decades. And today, he’s the guest on my show.

    Here is a list of Joe's books:
    Flexible Circuit Technology 4th Edition
    https://iconnect007.com/my-i-connect007/books/flex-circuit-technology

    Chip Scale Packaging for Modern Electronics
    https://www.emerald.com/insight/content/doi/10.1108/cw.2004.21730bae.001/full/html

    Solderless Assembly for Electronics: The SAFE Approach
    https://iconnect007.com/my-i-connect007/books/solderless-assembly-electronics-safe-approach#:~:text=SAFE%20technology%20(Solderless%20Assembly%20For,design%20efficacy%2C%20reliability%20and%20security.

    Joe's Company:
    Verdant Electronics
    https://verdantelectronics.net

    Chapters:
    00:00:00 Importance of Flexible Circuits in Modern Electronics
    00:02:42 Exploring the World of Flexible Circuits
    00:05:30 Introduction to Flexible Circuits: A Historical Perspective
    00:08:43 Entrepreneurship Mindset: Naivety and Innovation
    00:11:08 The Value of Naivety in Engineering
    00:13:43 Innovations in Bubble Printing Technology
    00:16:47 Understanding Flex Circuits: Applications and Challenges
    00:19:58 The Lifespan and Failure of Torsion Bars
    00:22:21 Evolution of Soldier Technology: From Heads-Up Displays to Wearables
    00:25:24 The Origins of the Integrated Circuit
    00:28:13 Advances in Microelectronics: From Printed Transistors to Modern Tech
    00:31:28 Challenges and Solutions in Flexible Circuit Design
    00:34:00 Collaborative Design for Efficient Manufacturing
    00:36:49 Advances in Flexible HDI and the Upcoming Ultra HDI Conference
    00:39:46 Evolution of Flexible Circuits: From 1903 to Present
    00:42:40 Innovating Flexible Circuits
    00:45:13 Evolution of Toll Road Technology
    00:48:08 The Future of Flexible and Stretchable Circuits
    00:51:53 Introduction to Verdant Electronics
    00:54:46 The Military's Stance on Lead-Free Technology
    00:56:27 Innovating Solderless Technology
    00:59:18 Insights on Persistence and Success in Entrepreneurship
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    1 時間 5 分
  • Episode 155: Ultra HDI Panel Discussion - Recorded Live at SMTAI

    Episode 155: Ultra HDI Panel Discussion - Recorded Live at SMTAI
    2024/10/29
    Today, I’m in Rosemont Illinois at SMTAI, Surface Mount Technology International. I’m in the Ultra-HDI Pavilion on the trade show floor. And what are we going to talk about here in the Ultra-HDI pavilion? Ultra high density interconnects, of course.

    As the demand for smaller, faster, and more powerful devices grows, the need for innovative solutions in circuit design has never been greater. UHDI's represent a significant leap forward, allowing for more connections in a smaller space, pushing the boundaries of what's possible in electronic assemblies.

    But what exactly are UHDI's? Essentially, they refer to circuit boards with incredibly fine pitch interconnects, enabling higher functionality and complexity in much smaller form factors.
    This breakthrough is transforming industries like consumer electronics, aerospace, automotive, and medical devices, where space, weight, and performance are critical factors.

    In this episode, we’ll explore the advantages UHDI's bring to the table, from increased design flexibility and performance to better thermal management. We'll also discuss how UHDI's are set to impact the assembly process. With tighter tolerances and more intricate layouts, UHDI assemblies will require new approaches to assembly, inspection, and reliability testing.

    To better explain UHDI technology, we’ve put together a panel of subject matter experts. Tara Dunn, Director of Training and Education at the Surface Mount Technology Association (SMTA), will moderate a panel discussion with other subject matter experts.

    In addition to Tara, our other experts are Anaya Vardya CEO of American Standard Circuits, Chrys Shea from Shea Engineering Services, Michael Sivigny, owner and General Manager of CeTaQ Americas, and Oren Manor, Op-Center Core Program Business Director at Siemens Digital Industries Software.

    Ultra-HDI is here! And if you haven’t seen it on your assembly line yet, it’s coming, so stay tuned as we unpack the future of Ultra High Density Interconnects and what it means for the next generation of technology.
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    42 分
  • Episode 154: Thermal Profiling Best Practices

    Episode 154: Thermal Profiling Best Practices
    2024/10/22
    One of the most critical aspects of manufacturing high-reliability circuit assemblies is thermal profiling during the reflow process.

    Whether you're designing, engineering, or troubleshooting circuit assemblies, understanding how temperatures during the reflow process influences the quality and performance of your assemblies is essential.

    In this episode, we’ll break down what thermal profiling is, why it’s important, and how it affects everything from solder joint integrity to component placement.

    We’ll also explore the challenges and solutions involved in getting your thermal profile just right, ensuring your circuit assemblies are built to last in a competitive and demanding industry.
    Will review thermal profiling best practices, common mistakes, and the various capabilities of thermal profilers.

    I guest today is Mark Waterman. Mark is the Electronics division manager at ECD, a manufacturer of thermal profiling equipment founded in 1964. Mark began his career at ECD in 2006.
    I’ll ask Mark all about thermal profiling best practices right after this.

    Mark Waterman's Contact Information:
    Mark Waterman
    mark.waterman@ecd.com
    https://ecd.com
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    1 時間 1 分

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